SemiPOL enables precise grinding and polishing of various materials (optical lenses, semiconductor wafers, metal and non-metal crystal phases) for microscope (SEM, FIB, TEM, etc.) analysis. The target accuracy is micron level. It is mainly used for parallel grinding and polishing. Combined with more accessories, it can make the grinding and polishing of complex special-shaped parts and surfaces easier.

Real-time monitoring of the amount of material removal, or quantitatively set the amount of material grinding and realize unattended operation. Driven by double stepping motors, respectively control the swing speed and amplitude of the grinding seat to improve the flatness, smoothness and the utilization rate of grinding consumables.Size of grinding disk: 8 inches (Φ203mm).

Speed of Grinding disc: 0–600rpm, forward/reverse rotation;

LCD screen for real-time display of material removal amount with a resolution of 1um and a stable accuracy of 10um；

The amount of material grinding can be set, with a resolution of 1um and a stable accuracy of 10um. When the amount of grinding debris reaches the set value, the equipment will automatically stop running;

The grinding time can be set, when the grinding time reaches the set value, the equipment will automatically stop running;

7-inch LCD display/touch screen, can save/edit at least 20 groups of parameters;

The sample can be set to rotate or not, and can be set to swing back and forth, and the swing range is adjustable;

Automatic/manual control of cooling water on and off;

The power of the spindle motor is 750W, and the servo motor is used to ensure high torque and constant torque output;

The sample swing adopts a stepper motor, which has a larger torque and is more durable.